TCS Unveils Chiplet-Based System Engineering Solutions

Tata Consultancy Services (TCS) has launched chiplet-based system engineering services to support semiconductor companies in designing the next generation of processors. This initiative strengthens India’s ambition to become a global semiconductor hub, while catering to the rapidly growing demand for chips across industries like AI, cloud computing, electric vehicles, and consumer electronics.

What Are Chiplets and Why They Matter

Chiplets are smaller, modular integrated circuits that act as building blocks for larger chips. Unlike traditional monolithic chips, chiplets allow companies to design faster, more efficient, and scalable processors by integrating multiple specialized components.

• This modular approach boosts performance.

• It helps reduce development costs.

• It enables flexibility in integrating new technologies such as AI accelerators, cloud-based computing power, and advanced connectivity.

With demand for high-performance computing and energy-efficient processors at an all-time high, chiplet-based engineering is poised to redefine semiconductor innovation.

India’s Semiconductor Market Outlook

India’s semiconductor market is currently valued at USD 45–50 billion and is expected to more than double, reaching USD 100–110 billion by 2030.

This growth is backed by the government’s ₹76,000 crore India Semiconductor Mission, which aims to promote chip design, manufacturing, and assembly in the country.

• Nearly 20% of the world’s chip design engineers are already based in India.

• Global firms are investing heavily in Indian design centers and fabrication facilities.

TCS’ new offering aligns with this vision, giving both domestic and international companies access to advanced chip-to-system engineering expertise.

TCS’ Chiplet-Based System Engineering Capabilities

The IT giant’s new services include:

• Design and Verification of Industry Standards such as UCIe (Universal Chiplet Interconnect Express) and HBM (High Bandwidth Memory).

• Advanced Packaging Solutions, including 2.5D and 3D interposers for integrating heterogeneous devices.

• End-to-End Chiplet Integration, ensuring faster time-to-market for next-gen processors.

Recently, TCS partnered with a North American semiconductor company to integrate heterogeneous devices for AI processors, helping accelerate development cycles and reduce launch timelines.

Statement from TCS Leadership

Highlighting the importance of this initiative, V Rajanna, President, Technology, Software and Services at TCS, stated:

“Semiconductors are the foundational technology driving digital innovation and powering differentiated experiences. TCS Chiplet-based System Engineering services will help semiconductor enterprises accelerate chiplets tapeout, driving flexibility, scalability, and faster time to market. Our extensive investments in next-gen technologies, contextual knowledge of the semiconductor industry, and strong track record in execution make us the preferred partner to drive innovation at scale.”

Why This Matters for Global Semiconductor Innovation

The semiconductor industry is facing challenges of increasing complexity, miniaturization, and energy efficiency demands. By adopting chiplet-based designs, companies can:

• Reduce dependency on large-scale, costly monolithic chips.

• Accelerate innovation in sectors like AI, 5G, cloud, and automotive.

• Leverage modular architectures that make processors more scalable and adaptable to future technologies.

TCS’ services will give semiconductor players a competitive edge, especially as global supply chains shift and companies look to India as a key innovation hub.

Conclusion

TCS’ launch of chiplet-based system engineering services comes at a critical time when semiconductor demand is booming worldwide. With India’s growing role in global chip design and the government’s ambitious semiconductor mission, this move positions TCS as a strategic partner for both Indian and international semiconductor enterprises.

By combining advanced chiplet design, verification, and packaging capabilities, TCS is enabling companies to shorten time-to-market, boost scalability, and power the next wave of digital innovation.