MediaTek Announces first mmWave 5G Chipset

Taiwanese chipmaker MediaTek announced on Monday Dimensity 1050 System on Chip, the first mmWave 5G chipset to power the next generation of 5G smartphones. With dual mmWave and sub 6GHz connectivity, Dimensity 1050 claims to provide the speed and capacity to provide a seamless experience for 5G smartphone users.

The Dimensity 1050 will be able to offer smartphones up to 53% faster speeds and a wider range compared to LTE+ mmWave aggregation alone. The SoC integrates two premium Arm Cortex A78 CPUs with speeds up to 2.5GHz and the latest Arm Mali G610 graphics engine.

In addition to MediaTek's HyperEngine 5.0 gaming technology, the chipset also offers WiFi optimization, ensuring low latency connectivity with the new tri-bands, 2.4GHz, 5GHz, and 6GHz, extending playtime and performance.

It also supports an ultra-fast 144Hz full HD+ display, dual HDR video capture engine, excellent noise reduction for excellent low light photography, and WiFi 6E support. Dimensity 930 and Helio G99 are two other chipsets that MediaTek announced. 

The company announced that smartphones with Dimensity 930 will be available in the second quarter of 2022, and smartphones with Dimensity 1050 and Helio G99 will be available in the third quarter of this year.